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Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process.
Name Bytes Width Height DPI Media Type
small 261220 792 445 72 image/jpeg
medium 560959 1369 770 300 image/jpeg
large 1321867 2313 1301 300 image/jpeg
x_large 4111953 4212 2369 300 image/jpeg
xx_large 6390379 6400 3600 300 image/jpeg
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Royalty Free Image Size: small: 792 x 445 Pixels, medium: 1369 x 770 Pixels, large: 2313 x 1301 Pixels, x_large: 4212 x 2369 Pixels, xx_large: 6400 x 3600 Pixels, - Orientation: Horizontal

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Equipment Built Structure Industrial Equipment Development Industry Research Science Technology Horizontal Conveyor Belt Factory Making Manufacturing CPU Circuit Board Computer Chip Production Line Package Machine Part Cleanroom Color Image Packaging Electronics Industry Electrical Component Disk Silicon Computer Wafer Food Processing Plant Wafer No People Photography Foundry Computer Lithograph Semiconductor Transistor Nanotechnology Artificial Metal Industry Game Controller Microcontroller Arm Limb - Body Part Scarce Brand Name Video Game

Equipment Built Structure Industrial Equipment Development Industry Research

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